This call for tenders concerns bonding equipment for die-to-wafer direct bonding equipment for 3D microelectronic applications. Placement accuracy of less than 1 μm with a throughput of at least 150 chips / h is expected. Direct bonding is a spontaneous assembly process at room temperature and atmospheric pressure, very sensitive to contamination by particles. Therefore, extremely low particulate contamination when handling dies and mechanical movements is also required.

This call for tenders concerns bonding equipment for die-to-wafer direct bonding equipment for 3D microelectronic applications. Placement accuracy of less than 1 μm with a throughput of at least 150 chips / h is expected. Direct bonding is a spontaneous assembly process at room temperature and atmospheric pressure, very sensitive to contamination by particles. Therefore, extremely low particulate contamination when handling dies and mechanical movements is also required.