Description:

The project involves supplying, delivering, and installing a scanning acoustic microscope capable of non-destructively inspecting semiconductor packages for delamination and structural issues, with specific requirements for sample size and imaging outputs.

Supply, Delivery, Installation of Scanning Acoustic Microscopy equipment.
NMIS require C-SAM (scanning acoustic microscope) capability. C-SAM is required to non-destructively inspect work-pieces at various stages of our semiconductor packaging process. We require a machine that can accept samples approximately 500 x 500 mm and is suitable for use in a semiconductor manufacturing context to detect delamination and other structural discontinuities in semiconductor packages. Machine outputs should include high resolution C-Scan images, and possibly A- and B- scan images.

NMIS require C-SAM (scanning acoustic microscope) capability. C-SAM is required to non-destructively inspect work-pieces at various stages of our semiconductor packaging process. We require a machine that can accept samples approximately 500 x 500 mm and is suitable for use in a semiconductor manufacturing context to detect delamination and other structural discontinuities in semiconductor packages. Machine outputs should include high resolution C-Scan images, and possibly A- and B- scan images.

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The Buyer:

University of Strathclyde

Additional information:

Link:

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Link:

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CPV Code(s):

38510000 - Microscopes