Miscellaneous special-purpose machinery | Tenderlake

Miscellaneous special-purpose machinery

Contract Value:
-
Notice Type:
Contract Notice
Published Date:
12 August 2022
Closing Date:
08 September 2022
Location(s):
DE212 München, Kreisfreie Stadt (DE Germany/DEUTSCHLAND)
Description:
Wafer-Profilometer - PR160663-2270-W

Wafer-Profilometer

1 pc of Wafer-Profilometer with options:

1.4.2. Additional licenses for offline data analyses and reporting

2.1 Bottom Side Sensors for measurement of thicknesses

2.2 a) Vacuum chucks for 6" and 8"

2.2 b) Alignment tools for samples < 50 mm x 50 mm or sample arrays

3. First training of engineers/operators in machine handling included.

Download full details as .pdf
The Buyer:
Fraunhofer-Gesellschaft - Einkauf C2
CPV Code(s):
42990000 - Miscellaneous special-purpose machinery