Research, testing and scientific technical simulator
Contract Value:
EUR 380K - 380K
Notice Type:
Contract Notice
Published Date:
20 December 2021
Closing Date:
27 January 2022
Location(s):
ITH20 Trento (IT Italy/ITALIA)
Description:
Supply of a silicon wafers polishing tool
The contract is aimed at the supply of a silicon wafers polishing tool (CMP) for the development of the FBK Facility “3D Integration” in the context of the IPCEI microelectronics project.