CEA LETI wishes to acquire laser cutting equipment compatible with a cleanroom process. The equipment must be able to groove, clean and cut the silicon wafer.
This equipment is intended to process wafers from 50 to 300 mm, with or without a frame or ring, and is intended for cutting semiconductor wafers (with or without a device).
- Option n°1 (facultative) : Station de nettoyage (Cleaning station) ;
- Option n°2 (optional): Heat exchangers / chillers;
- Option n°3 (optional): 1st level Maintenance training;
- Option n°4 (optional): Advanced Maintenance Training;
- Option n°5 (optional): The price of transport, including insurance, according to the conditions of DAP CEA Grenoble (Incoterms ICC 2020 Convention)
CEA-LETI wishes to acquire laser cutting equipment compatible with a cleanroom process. The equipment must be able to groove, clean and cut the silicon wafer.
This equipment is intended to process wafers from 50 to 300 mm, with or without a frame or ring, and is intended for cutting semiconductor wafers (with or without a device).
- Option n°1 (facultative) : Station de nettoyage (Cleaning station) ;
- Option n°2 (optional): Heat exchangers / chillers;
- Option n°3 (optional): 1st level Maintenance training;
- Option n°4 (optional): Advanced Maintenance Training;
- Option n°5 (optional): The price of transport, including insurance, according to the conditions of DAP CEA Grenoble (Incoterms ICC 2020 Convention)