The subject of the order is the delivery, installation and commissioning of a dry chemical etching plant (RIE) including training

As part of the DTEC project, the Bundeswehr University is planning to procure a dry chemical etch plant (a RIE (reactive ion etch) plant). A proven system is being sought that is suitable for etching dielectric layers (e.g. silicon nitride, silicon oxide, polymers and photoresists) and silicon. The layers to be etched are located on silicon substrates. Substrate formats here are mainly wafers with diameters of 100 mm, 150

mm and 200 mm; however, smaller formats and fragments are also to be etched in the system. Double-sided polished wafers are also processed.

Details can be found in the service description.