Microelectronic machinery and apparatus | Tenderlake

Microelectronic machinery and apparatus

Contract Value:
-
Notice Type:
Contract Notice
Published Date:
25 October 2023
Closing Date:
20 November 2023
Location(s):
FRK24 Isère (FR FRANCE)
Description:
Acquisition of an additive manufacturing machine by printing targeting micrometric to sub-micrometer resolution

Acquisition of an additive manufacturing machine by printing targeting micrometric to sub-micrometer resolution

It is a machine operating in a research and development environment within an academic laboratory. The main research projects related to the use of this machine aim to deposit dispersed or networked nanowires, thin films by sol-gel process, nanoparticles or 2D materials (flakes), dispersed or in networks. The projects also require the possibility of depositing conductive thin films (electrode production), insulating thin films and polymeric thin films (insulation, microfluidics)

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The Buyer:
institut polytechnique de Grenoble
CPV Code(s):
31712100 - Microelectronic machinery and apparatus