CEA LETI wishes to acquire automatic grinding equipment (cassette to cassette) for grinding 200 mm and 300 mm diameter silicon wafers into thin silicon wafers. The equipment must be able to set a different thickness target for each slot.

The equipment will allow measurements to be made during the thinning process, using a mechanical gauge and an optical system.

CEA LETI wishes to acquire automatic grinding equipment (cassette to cassette) for grinding 200 mm and 300 mm diameter silicon wafers into thin silicon wafers. The equipment must be able to set a different thickness target for each slot.

The equipment will allow measurements to be made during the thinning process, using a mechanical gauge and an optical system.

- Option n°1 (optional): Heat exchangers / chillers;

- Option n°2 (optional): 1st level maintenance training

- Option n°3 (optional): Advanced Maintenance Training;

- Option n°4 (optional): The price of transport, including insurance, according to the conditions of DAP CEA Grenoble (ICC Incoterms Convention 2020)

Pursuant to Article L 2113-10 of the French Public Procurement Code, the subject matter of the contract does not allow the identification of separate services,