CIME Nanotech wishes to acquire a 300mm automatic semiconductor wafer cutting machine to complete the equipment that makes up its "Hybrid Cutting-Assembly" workshop. This equipment will help meet a growing demand for service for 300mm semiconductor wafer cutting

CIME Nanotech wishes to acquire a semiconductor materials cutting machine to complete the equipment that makes up its "Hybrid Cutting-Assembly" packaging workshop. The cutting equipment will make it possible to meet a growing demand for services around the acquisition of microelectronic chips; it will be used to cut samples and semiconductor wafers from 2 inches to 300mm diameters, SEMI standard