Delivery of a 3D-capable 5-axis printer for printed electronics. The printer must enable the processing of conductive inks in the field of application of printed electronics. Furthermore, substrates with different materials and 3D structures are used, the substrates have to be equipped with electrical components and PCBs and the resulting system has to be post-processed depending on the process. The associated software must allow a simple and flexible layout and support the manufacturing process in the printer in all aspects.

• System for installation on the laboratory bench.

• The system must contain at least 5 axes for printing 3D substrates.

• The radius of movement must be at least: x/y/z ≥ 400/300/140 mm (X, Y, Z axis) with a repeatability of ≤ 15 μm; Rotation axis repeatability ≤ 0° 0' 10''

• The following functions must be included:

o Jettendes process for printing structure sizes between 300μm-1000 μm with highly viscous and/or conductive inks and pastes, including replacement nozzles with diameters of 50μm and 100μm (at least one each).

o An FFF unit for building substrates (filament) with 5-axis slicing software and height sensor

o Heatable substrate table with infinite axis rotation

the SMD-Bestückungseinheit

o CNC milling unit for reworking substrates

o Photonic sintering unit with infrared LED

o Pneumatic spraying unit with variable pressure

• The system must be expandable with the following functions:

o Aerosol-based print head

o Tin-based printhead

o Jet-based single and multi-nozzle printing for a wide range of materials, including conductive materials

o Dispensing unit with up to 5 heads

o Pellet extruder for FFF unit

o Plasma treatment unit

o Confocal camera system

o UV unit for exposing paints, for example

o Thermal camera for surface inspection

o Cameras for monitoring tools, analysis of the print result

• Software must include:

o Possibility to work offline

o Support of the various functions within a software

o CAD/CAM software for the refurbishment of 3D circuits and 3D circuit carriers

o Image analysis for the alignment of 3D objects and 3D circuit carriers with the help of fiducials

o Adaptive, image-based system for automated alignment/calibration of tools

o Integration of camera system for function monitoring

the Bewegungssimulation

• Power supply: 230 V