Miscellaneous special-purpose machinery | Tenderlake

Miscellaneous special-purpose machinery

Contract Value:
EUR -
Notice Type:
Contract award notice
Published Date:
25 January 2023
Closing Date:
Location(s):
DED2 Dresden (DE Germany/DEUTSCHLAND)
Description:
Measurement equipment for bow, wafer thickness and TSV - PR45184-2480-W

Measurement equipment for bow, wafer thickness and TSV

1 pc. Measurement equipment for bow, wafer thickness and TSV

Awarded to:
Measurement equipment for bow, wafer thickness and TSV
Sentronics Metrology GmbH, Mannheim (DE)
Download full details as .pdf
The Buyer:
Fraunhofer-Gesellschaft - Einkauf C2
CPV Code(s):
42990000 - Miscellaneous special-purpose machinery