Microelectronic machinery and apparatus | Tenderlake

Microelectronic machinery and apparatus

Contract Value:
EUR 2M - 2M
Notice Type:
Contract Notice
Published Date:
06 July 2022
Closing Date:
08 August 2022
Location(s):
DE136 Schwarzwald-Baar-Kreis (DE Germany/DEUTSCHLAND)
Description:
Laserschneidanlage Stealth-Dicer

Delivery and installation of a fully automatic laser cutting system for the separation of silicon substrates by means of stealth dicing incl. accessories / pre-processing of the substrates according to specification

Delivery and installation of a fully automatic laser cutting system for the separation of silicon substrates by means of stealth dicing incl. accessories / pre-processing of the substrates according to specification

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The Buyer:
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
CPV Code(s):
31712100 - Microelectronic machinery and apparatus