The subject matter of this contract is the supply and installation of scientific equipment to INL, listed below and detailed in Schedule V attached to these Standard Specifications (from now on referred to as ‘Specifications’).
The equipment listed in Schedule V are the lots that the tender comprises.
Tenderers may bid for one or more lots. The subject matter of the contract, in all cases, does not include so-called refurbished scientific instruments and equipment.
The three lots comprising the tender are as follows;
1. Optical inspection system
2. Pick and place bonding system
3. Optical Emission Spectrometer
Acquisition of two optical microscopes for wafer defect inspection and in-line process metrology.
The technical requirements for these microscopes are listed below. The microscope resolution should allow observation of sub-micron features (less than 0.5μm).
Tender for a sub-micron die-bonder for precision die attach and advanced chip packaging. The equipment should be able to handle a wide range of applications, including opto-devices assembly (LEDs, photodetectors, Lens, micro-optics), generic MEMS and MOEMS assembly, 2.5D and 3D IC assembly (stacking), Flip-chip assembly and precision die bonding (glueing and curing).
The system should run most of the basic bonding technologies such as thermosonic, ultrasonic, thermo-compression, soldering/eutectic, adhesive and sintering and able to handle component sizes from 30μm x 30μm up to 20mm x 20mm. The system has its main purpose for prototyping, but it also expected support for low volume production and therefore the ability to handle components from full diced wafers (200mm) or sections of wafers. The systems should contemplate Pick operation from sources as wafer frame (diced wafer), waffle pack and Gel-Pak®; and Place operation to destinations as substrates, waffle pack and Gel-Pak®, full wafers (for 2.5D, 3D, CoW).
Tender for an optical spectrometer to be integrated in a Nordiko Reactive Ion Etching Module and used as an etching end-point detector.