    
                        Microelectronic machinery and apparatus
                    
                                Contract Value:
                                EUR 2M - 2M
                                Notice Type:
                                Contract award notice
                            
                                Published Date:
                                31 October 2022
                                Closing Date:
                                
                                Location(s):
                                        DE136 Schwarzwald-Baar-Kreis (DE Germany/DEUTSCHLAND)
                            
                        Description:
                        
                        Laserschneidanlage Stealth-Dicer
Laserschneidanlage zur Vereinzelung von Silizium-Substraten mittels Stealth Dicing
Laserschneidanlage zur Vereinzelung von Silizium-Substraten mittels Stealth Dicing

                                Awarded to:
                                        Laserschneidanlage Stealth-Dicer
                                        Diso Hi-Tec Europe GmbH, Kirchheim (DE)
                            
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                            The Buyer:
                            Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
                            
                            CPV Code(s):
                                31712100 - Microelectronic machinery and apparatus