Supply, Delivery and Installation of Laser Depanelling & Singulation
Contract Value:
GBP 825K -
Notice Type:
Contract Notice
Published Date:
30 August 2024
Closing Date:
01 October 2024
Location(s):
UKM82 Glasgow City (UK UNITED KINGDOM)
Description:
University of Strathclyde and National Manufacturing Institute Scotland are seeking laser equipment for depaneling PCBs, singulating lead frames, laser marking components, and welding metal lids to support the expansion of manufacturing capability in semiconductor advanced packaging for power electronic semiconductors at an ISO-7 clean room environment.
Supply, Delivery and Installation of Laser Depanelling & Singulation. The University of Strathclyde has a requirement for laser equipment that can depanel printed circuit boards, singulate over moulded lead frames, laser mark components and weld metal lids to metal packages.
The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. This is in support of a publicly funded project that will see the creation of an advanced, scaled up packaging facility for power electronics within the National Manufacturing Institute Scotland. The overall scale up manufacturing facility is to be housed at an NMIS site; this semiconductor advanced packaging area will be housed in an ISO-7 (previously class 10,000) clean room environment. The equipment will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. The University of Strathclyde has a requirement for laser equipment that can depanel printed circuit boards, singulate over moulded lead frames, laser mark components and weld metal lids to metal packages