As part of the DTEC project, the University of the German Armed Forces is planning to procure a sputtering system with a loadlock chamber. A tried-and-tested system is being sought to apply metallic and dielectric layers by means of sputtering. The system should be so flexible that an extension for ESV evaporation or additional targets is possible without further or greater financial outlay. Silicon wafers with diameters of 100 mm and 150 mm are used as substrates. Double-sided polished wafers are also used. Furthermore, it must also be possible to process fragments or chips in the system.

In the field of semiconductor technology, the application of metallic and dielectric layers is an important component. Sputtering systems are used for this purpose.

The main focus is on the quality and reproducibility of the results (homogeneity, reproducibility, layer thickness). The system should be user-friendly in order to process the necessary wafers as easily and quickly as possible.

In addition to the process-relevant details of the system, the safe use for the operator must also be taken into account. It is important to ensure that an increased hazard potential from mechanical and chemical components is excluded.

As part of the DTEC project, the University of the German Armed Forces is planning to procure a sputtering system with a loadlock chamber. A tried-and-tested system is being sought to apply metallic and dielectric layers by means of sputtering. The system should be so flexible that an extension for ESV evaporation or additional targets is possible without further or greater financial outlay. Silicon wafers with diameters of 100 mm and 150 mm are used as substrates. Double-sided polished wafers are also used. Furthermore, it must also be possible to process fragments or chips in the system.

In the field of semiconductor technology, the application of metallic and dielectric layers is an important component. Sputtering systems are used for this purpose.

A main focus is on the quality and reproducibility of the results (homogeneity, reproducibility, layer thickness). The system should be user-friendly in order to process the necessary wafers as easily and quickly as possible.

In addition to the process-relevant details of the system, the safe use for the operator must also be taken into account. It is important to ensure that an increased hazard potential from mechanical and chemical components is excluded.