Lithograph Track for Photographic Materials

1 Piece Lithograph Track for Photographic Materials

The specification describes an automatic coating and processing device for the lithographic structuring of layers in the field of 2.5D/3D wafer-level system integration for the generation of highly integrated microelectronic 2.5D/3D systems based on 300mm wafer substrates. The device will be used to coat and develop polymer materials and photoresists with a layer thickness of 0.5-200μm, which makes it possible to realize structures in the 1μm range. The fully automatic processing is recipe-based.

10 Bedarfspositionen - BP

10.6. Two additional identical proximity heating plates in accordance with 5.7.2 (BP)

10.7. An additional Spin Coater process module according to 5.6 which can be integrated into the base frame. (BP)

10.8. FFUs to create a Class 100/ISO 5 cleanroom within the enclosed equipment environment to improve the environmental condition in accordance with 2.19. (BP)