Microelectronic machinery and apparatus | Tenderlake

Microelectronic machinery and apparatus

Contract Value:
-
Notice Type:
Contract Notice
Published Date:
22 December 2023
Closing Date:
22 January 2024
Location(s):
FRK24 Isère (FR FRANCE)
Description:
Equipment 300mm track lithography 193nm

The purpose of this consultation is to provide a track for spreading and developing resins on behalf of CEA Grenoble.

The purpose of this consultation is to provide a track for spreading and developing resins on behalf of CEA Grenoble.

CEA-Leti wishes to acquire a runway for spreading and developing resins. This equipment will be installed in the CEA's clean room and interfaced with a latest-generation 193nm immersion scanner. It is intended to process 300mm plates for the development of advanced FDSOI technologies 10nm and beyond.

The consultation includes the following options:

- Mandatory options:

* Rapid annealing furnace at 600°C

* Control camera in modules

- Optional options:

* Low oxygen annealing furnace at 250°C

* Heat exchangers and cooling systems

* Electrical transformer

* Level 1 maintenance training

* Advanced maintenance training

* Second year warranty

Download full details as .pdf
The Buyer:
CEA/Grenoble
CPV Code(s):
31712100 - Microelectronic machinery and apparatus