Microelectronic machinery and apparatus | Tenderlake

Microelectronic machinery and apparatus

Contract Value:
-
Notice Type:
Contract Notice
Published Date:
31 January 2024
Closing Date:
26 February 2024
Location(s):
FRK24 Isère (FR FRANCE)
Description:
CEA-Leti is seeking to acquire millisecond annealing equipment and associated services for the development of advanced FDSOI technologies.
Provision of millisecond annealing equipment

CEA-Leti wishes to acquire millisecond annealing equipment. This equipment is intended to process plates with a diameter of 300mm and will be used to carry out the annealing steps of the FEOL and MOL, necessary for the development of advanced FDSOI technologies 10nm and beyond.

The proposed contract includes technical options that are described in the tender documents.

CEA-Leti wishes to acquire one (1) millisecond annealing equipment. This equipment is intended to process plates with a diameter of 300mm and will be used to carry out the annealing steps of the FEOL and MOL, necessary for the development of advanced FDSOI technologies 10nm and beyond. The services provided with this equipment include the associated services that are inseparable, such as installation, training, warranty, etc.

A number of technical options are described in the consultation package.

The object of the contract is the supply of millisecond annealing equipment and associated services, a single lot which may not be the subject of an allotment.

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The Buyer:
CEA/Grenoble
CPV Code(s):
31712100 - Microelectronic machinery and apparatus