The object of the tender is a 2-chamber Plasma Enhanced Atomic Layer Deposition Cluster with Automatic Wafer Handling (later also “Equipment” and/or "Tool") for coating of 200mm wafer substrates, or substrates that can be placed on such carrier wafers, with different metals, nitrides and oxides with process separation between metals/nitrides and oxides, and wafer handling from chamber-to-chamber and chamber-to-cassette without vacuum breaking.

The object of the tender process is described in more detail in the invitation to tender documents.

The object of the tender is a 2-chamber Plasma Enhanced Atomic Layer Deposition Cluster with Automatic Wafer Handling (later also “Equipment” and/or "Tool") for coating of 200mm wafer substrates, or substrates that can be placed on such carrier wafers, with different metals, nitrides and oxides with process separation between metals/nitrides and oxides, and wafer handling from chamber-to-chamber and chamber-to-cassette without vacuum breaking.

The tool must comply with technical properties and functionality, performance specifications and acceptance criteria set out in this Annex 1. The tool must also comply with the Cleanroom equipment standard safety and contamination requirements set out in Annex 2. A tender which does not meet one or more of the requirements specified in the annexes 1 and / or 2, may be rejected for failing to comply with the call for tenders.

The tool specifications are based on the following parameters or targets:

• Deposition uniformity

• Deposited film performance characteristics

• Substrate handling without errors and wafer loss

• Recipe library

The pricing of the equipment will consist of the main price for the minimum tool requirements (“total price of the equipment”) and a separate price for the optional parts, features and efforts. The optional parts, features and efforts are not included in the total price of the equipment.

The object of the tender process is described in more detail in the invitation to tender documents.