Automatic double-spindle wafer saw for processing wafers with max. 200 mm diameters of various thicknesses approx. 75 m to 1.6 mm thick wafers or wafers in the full- cut, half-cut or circle cut process and subsequent cleaning process
double spindle saw
General information:
— System for dicing 200 mm bicMOS wafers, for blade dicing processes (full cut, half cut, circle cut),
— Ability to functionally extend the tool for future IHP research activities (e.g. software extensions, hardware extensions).
Required functions of the double spindle saw:
— two-spindle (parallel sawing) system,
— Saw depth accuracy: +/- 5? m,
— Positioning accuracy wafer plane: +/- 2? m,
— Fully automatic robot handling system for 200 mm wafers and wafer stacks (thickness of 0.7 - 1.6 mm) without backside tape and without frame (box-to-box handling),
— Speaker holder compatible with existing 200 mm wafer boxes,
— Automatic inline cleaning function for substrates to prevent the drying of sawstock residues on the wafer surface,
— Automated cleaning of the relevant handling components,
— Automatic saw depth setup, including checking the saw blade contour,
— Automatic dress and flatscreen function,
— inline system to prevent oxidation of exposed metal contacts on the BiCMOS wafers,
— starter set saw blades (coarse and fine) and dresserboards,
— training for processes and plant operation/maintenance at IHP or in Germany,
— technical documentation and instructions in printed and digital form in German,
— System suitable for German power supply, 400 V, 3 phase, 50 Hz.
Optional functions of the double spindle saw:
— Sawing and Dicing Before Grinding (DBG) function, including handling systems and boxes,
— any necessary retrofit work should be possible with the least possible effort.
Service:
Upon completion of the equipment installation, 2 IHP employees will be trained to familiarize with the described tool within a reasonable time (min. 4 days). In addition, corresponding processes and recipes for standard wafers are set up to enable immediate processing.
When leaving a trained employee, the bidder undertakes to re-train an employee designated by the IHP.
Furthermore, the following support through at least 20 additional process or maintenance support days is part of the tender.
Maintenance and support requests must be processed by the bidder in a timely manner (1-2 weeks).
Additional Information:
The installations must be manufactured in accordance with current European, German and Brandenburg law, which must be demonstrated by an EC declaration of conformity. For this purpose, tenderers must provide the IHP with the necessary information. Furthermore, it must be demonstrated that the corresponding systems are already being successfully used by other research institutions/companies in the semiconductor industry. A two-year warranty, plant and process support for the retraction of the tool, as well as the delivery of appropriate hardware and recipes of the demo tests are the contents of the tender. Delivery, installation and technical acceptance by the end of Q1 2022 is absolutely necessary. The tool is intended to be installed and used in a laboratory and must therefore meet the appropriate purity requirements.
Automatic double-spindle wafer saw for processing wafers with max. 200 mm diameters of various thicknesses approx. 75 m to 1.6 mm thick wafers or wafers in the full- cut, half-cut or circle cut process and subsequent cleaning process
double spindle saw
General information:
— System for dicing 200 mm bicMOS wafers, for blade dicing processes (full cut, half cut, circle cut),
— Ability to functionally extend the tool for future IHP research activities (e.g. software extensions, hardware extensions).
Required functions of the double spindle saw:
— two-spindle (parallel sawing) system,
— Saw depth accuracy: +/- 5? m,
— Positioning accuracy wafer plane: +/- 2? m,
— Fully automatic robot handling system for 200 mm wafers and wafer stacks (thickness from 0.7 — 1.6 mm) without backside tape and without frame (box-to-box handling),
— Speaker holder compatible with existing 200 mm wafer boxes,
— Automatic inline cleaning function for substrates to prevent the drying of sawstock residues on the wafer surface,
— Automated cleaning of the relevant handling components,
— Automatic saw depth setup, including checking the saw blade contour,
— Automatic dress and flatscreen function,
— inline system to prevent oxidation of exposed metal contacts on the BiCMOS wafers,
— starter set saw blades (coarse and fine) and dresserboards,
— training for processes and plant operation/maintenance at IHP or in Germany,
— technical documentation and instructions in printed and digital form in German,
— System suitable for German power supply, 400 V, 3 phase, 50 Hz.
Optional functions of the double spindle saw:
— Sawing and Dicing Before Grinding (DBG) function, including handling systems and boxes,
— any necessary retrofit work should be possible with the least possible effort.
Service:
Upon completion of the equipment installation, 2 IHP employees will be trained to familiarize with the described tool within a reasonable time (min. 4 days). In addition, corresponding processes and recipes for standard wafers are set up to enable immediate processing.
When leaving a trained employee, the bidder undertakes to re-train an employee designated by the IHP.
Furthermore, the following support through at least 20 additional process or maintenance support days is part of the tender.
Maintenance and support requests must be processed by the bidder in a timely manner (1-2 weeks).
Additional Information:
The installations must be manufactured in accordance with current European, German and Brandenburg law, which must be demonstrated by an EC declaration of conformity. For this purpose, tenderers must provide the IHP with the necessary information. Furthermore, it must be demonstrated that the corresponding systems are already being successfully used by other research institutions/companies in the semiconductor industry. A two-year warranty, plant and process support for the retraction of the tool, as well as the delivery of appropriate hardware and recipes of the demo tests are the contents of the tender. Delivery, installation and technical acceptance by the end of Q1 2022 is absolutely necessary. The tool is intended to be installed and used in a laboratory and must therefore meet the appropriate purity requirements.