The object of the tender process was Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.

The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.

The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.

The object of the tender process was described in more detail in the invitation to tender documents.

The object of the tender process was Particle measurement tool (later “equipment” or “tool”). The equipment will be installed in the Micronova facility in Espoo, which is jointly used by VTT Technical Research Centre of Finland Ltd. (VTT) and Aalto University for research, development and small-volume production. The cleanroom classification is ISO 4…ISO 6 (10…1000). The total area of the cleanroom is 2 600 m2, and there is an installed equipment base of 200 processing and measurement tools.

The basic use for equipment is to detect particles and other defects and scratches on unpatterned silicon wafers and different materials on silicon surface. The tool must be non-contact and non-destructive for determining particles and defects on the surfaces of specific materials on silicon substrate. Typical materials to be analyzed are semiconductors, oxides, nitrides metals and photoresists.

The tool must be compatible with installation in an ISO 4 classified cleanroom. The tool must have an automatic mapping stage control system, and the stage must be suitable for 150 mm- and 200 mm silicon wafers. All parts needed for measuring 150 mm and 200 mm silicon wafers must be included in the offer.

The object of the tender process was described in more detail in the invitation to tender documents.