Microelectronic machinery and apparatus | Tenderlake

Microelectronic machinery and apparatus

Contract Value:
-
Notice Type:
Contract Notice
Published Date:
12 September 2019
Closing Date:
11 October 2019
Location(s):
DE211 Ingolstadt, Kreisfreie Stadt (DE Germany/DEUTSCHLAND)
Description:
Bonder - Microelectronics packaging

As part of the IQLED project, Technische Hochschule Ingolstadt (THI) would like to procure an advanced bonder for the research lab "Microelectronics packaging".

As part of the IQLED project, the Technische Hochschule Ingolstadt (THI) would like to procure an Advanced Bonder for the research laboratory 'Microelectronics Packaging'.

As part of the IQLED project, Technische Hochschule Ingolstadt (THI), would like to procure an advanced bonder for reasearch lab "Microelectronics packaging".

As part of the IQLED project, THI wants to procure an Advanced Bonder for the research laboratory "Microelectronics Packaging".

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The Buyer:
Technische Hochschule Ingolstadt
CPV Code(s):
31712100 - Microelectronic machinery and apparatus