Framework announcement

Sub-THz packages

1 goal

The aim is to build demonstrators that enable and characterize novel connection and packaging technologies (e.g. Si interposer, wafer packages and integrated antennas) in combination with integrated circuits (IC) in a frequency range of 60 GHz - 1 THz in order to be able to consider them as part of design kits already in the IC design phase.

Since the services to be provided include various semiconductor and connection technologies, the entirety of the connections implemented with a specific demonstrator is referred to as a “target interconnect”.

Framework announcement

Sub-THz packages

1. Goal

The aim is to build demonstrators that enable and characterize novel connection and packaging technologies (e.g. Si interposer, wafer packages and integrated antennas) in combination with integrated circuits (IC) in a frequency range of 60 GHz - 1 THz in order to be able to consider them as part of design kits already in the IC design phase.

Since the services to be provided include various semiconductor and connection technologies, the entirety of the connections implemented with a specific demonstrator is referred to as a "target interconnect".

2. Specification:

2.1. running time

The individual orders are placed within 3 years of the award.

The duration of a single demonstrator project should not exceed about 9 months.

2.2. Overall scope:

The total order includes 12 demonstrators,

2.3. Scope of delivery of a demonstrator package:

1. At least 10 pieces of the required package on a suitable carrier (e.g. wafer, PCB) with appropriate connections or other appropriate facilities for evaluating the measurement results,

2. Layout data / 3D layout model of the target interconnect, exportable to other design environments,

3. Documentation with the following sections:

a) General information on the connection technology used,

b) description of the geometric framework,

c) layout description (data format on request),

d) Notes on the use of connection technology and possible further developments.

2.4. Provisions by the client

The client provides the ICs to be used in each case. At least 1 functional wafer is handed over per demonstrator.

In addition to the ICs provided, the necessary layout information, a short functional description and information on the electrical properties are provided, which are necessary for the development of the demonstrator,

2.5. Basis of calculation:

2.5.1 Scope of work for personnel:

a) A workload of approx. 2 person months is estimated per demonstrator.

2.5.2. Other costs:

a) Costs for materials, services, personnel overhead and other expenses are paid at a flat rate.

b) The expenditure for non-personnel costs is estimated at about 50% of the total costs.

2.6. Time frame:

a) The 12 demonstrators are worked out one after the other (serial), whereby a partial overlap is possible. As a rule, 2 demonstrators are commissioned in parallel every 4 months.

b) After the specification of the target interconnect has been handed over to the contractor, the contractor will draw up a project plan within 2 weeks, which must be confirmed by the client within a further 2 weeks or, if revised, within 4 weeks. This is followed by the formal award of the contract to the contractor.

c) The customer shall deliver the ICs and other materials to be provided no later than 6 months after the order has been placed. Any delays lead to a correction of the project plan.

2.7. Payment terms:

a) The following rules apply per demonstrator.

b) When placing an order, 25% of the person months estimated in the project plan can be invoiced as a start payment.

c) At least 20% of the person months estimated in the project plan must be provided for the final invoice.

d) Further payments of up to 25% of the person months estimated in the project plan can be invoiced after proof of the partial performance has been provided, whereby the sum of the final invoice mentioned under c) has to be omitted.

2.8.a) Sample project plan:

- 1 point per time and personnel and material resource planning;

- 1 additional point for presentation of quality management.

2.8.b) Infrastructure at the contractor:

- 1 point per technology step.

2.9 Documents to be submitted:

a) Mandatory: presentation of the sub-items mentioned under point 2.8,

b) Optional: further documents etc., which prove the suitability and previous experience of the contractor.