CEA-Leti wants to acquire a defect inspection and review machine for chip-to-plate bonding applications. This equipment will have to process plates, 300mm in diameter or less, as well as frames on which plates or chips will be placed. It will be used for the detection and review of defects on silicon wafers or products, as part of the development of 3D packaging technologies.
CEA-Leti wants to acquire a defect inspection and review machine for chip-to-plate bonding applications. This equipment will have to process plates, 300mm in diameter or less, as well as frames on which plates or chips will be placed. It will be used for the detection and review of defects on silicon wafers or products, as part of the development of 3D packaging technologies.
The contract includes the following optional options:
o OPT1: Heat exchangers and cooling systems
o OPT2: Electrical Transformer
o OPT3: Level 1 Maintenance Training
o OPT4: Advanced Maintenance Training