— Precision cleaning of semiconductor system parts with ultra-pure quality qualified for the IHP,

— Mind. cleanroom conditions (class ISO 5),

— access to the part numbers of Applied Materials,

— Analgenies/chambers to be cleaned:

—— Applied Materials: txZ, wxZ, TTN Widebody, Ti IMP, PCII, AlcU, NiPt, Co,

—— DPS, DPS+, Poly DPS, Metal DPS, emXP, HDP, DxZ,

—— SPTS: rapier, synapse, APM.

— Precision cleaning of semiconductor system parts with ultra-pure quality qualified for the IHP,

— Mind. cleanroom conditions (class ISO 5),

— access to the part numbers of Applied Materials,

— Analgenies/chambers to be cleaned

—— Applied Materials: txZ, wxZ, TTN Widebody, Ti IMP, PCII, AlcU, NiPt, Co,

—— DPS, DPS+, Poly DPS, Metal DPS, emXP, HDP, DxZ,

—— SPTS: rapier, synapse, APM.