The following specification describes the requirements of an ellipsometric layer thickness measuring device for inline operation in the clean room. Wafer sizes of 300 mm and optionally 200 mm are to be served. In particular, there is both technical redundancy and the possibility of reliably measuring future requirements for this measuring method using DBS / SE / SWE.

The following specification describes the requirements of an ellipsometric layer thickness measuring device for inline operation in the clean room. Wafer sizes of 300 mm and optionally 200 mm are to be served. In particular, there is both technical redundancy and the possibility of reliably measuring future requirements for this measuring method using DBS / SE / SWE.