The object of the tender is a 2-chamber Plasma Enhanced Atomic Layer Deposition Cluster with Automatic Wafer Handling (later also “Equipment” and/or "Tool") for coating of 200mm wafer substrates, or substrates that can be placed on such carrier wafers, with different metals, nitrides and oxides with process separation between metals/nitrides and oxides, and wafer handling from chamber-to-chamber and chamber-to-cassette without vacuum breaking.

The object of the tender process is described in more detail in the invitation to tender documents.

The object of the tender is a 2-chamber Plasma Enhanced Atomic Layer Deposition Cluster with Automatic Wafer Handling (later also “Equipment” and/or "Tool") for coating of 200mm wafer substrates, or substrates that can be placed on such carrier wafers, with different metals, nitrides and oxides with process separation between metals/nitrides and oxides, and wafer handling from chamber-to-chamber and chamber-to-cassette without vacuum breaking.

The object of the tender process is described in more detail in the invitation to tender documents.