Die-stamping machines | Tenderlake

Die-stamping machines

Contract Value:
EUR 656K - 656K
Notice Type:
Contract award notice
Published Date:
05 February 2024
Closing Date:
Location(s):
ITC4C Milano (IT Italy/ITALIA)
Description:
Open procedure for the supply of equipment for additive manufacturing of metallic components using Laser Powder Bed Fusion (LPBF) or Selective Laser Melting (SLM) processes.
Awarded to:
procedura aperta per la fornitura di apparecchiatura per la produzione additiva di componenti metallici tramite processo Laser Powder Bed Fusion (LPBF) o Selective Laser Melting (SLM)
EOS S.r.l. Electro Optical Systems, Milano (IT)
Download full details as .pdf
The Buyer:
UNIVERSITA' DEGLI STUDI DI MILANO
CPV Code(s):
42635000 - Die-stamping machines