3D LIT-OBIRCH System (IMWS-2.1) +Scanning Electron Microscope with ultrafast e-beam operation (IMWS-3.1)
3D LIT-OBIRCH System (IMWS-2.1) +Scanning Electron Microscope with ultrafast e-beam operation (IMWS-3.1)
LOT-0001
Item 1: 3D LIT-OBIRCH System (IMWS-2.1).
The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behavior, reliability, safety, and longevity of innovative materials in components and systems. The "Electronic Materials and Components" department of Fraunhofer IMWS supports industry and research partners with its internationally recognized expertise in the fault analysis of electronic components. The Fraunhofer IMWS will expand its capabilities in advanced fault analysis and material characterization to support the development of new heterogeneous integration technologies, thereby addressing manufacturing and reliability challenges.
The Fraunhofer IMWS has extensive experience in the application and development of non-destructive thermal defect localization methods for fault analysis, particularly in semiconductors for automotive electronics, where precise non-destructive testing is essential. Thanks to its long-standing experience in the development of lock-in thermography methods (LIT) and the development of advanced signal processing methods, the Fraunhofer IMWS has continuously pushed the boundaries of LIT technology to improve resolution and sensitivity, especially for 2.5D/3D imaging and modern packaging applications.
To further enhance defect localization capabilities in 3D components and IC stacks, the integration of a combined Lock-In Thermography (LIT) and OBIRCH (Optical Beam Induced Resistance Change) measurement system is planned. This allows precise localization of defects with thermal emission and, additionally, the localization of defects without sufficient thermal emission but with electrical sensitivity during optical excitation. The system should be open for the development of proprietary applications for advanced signal processing of the measured values to improve sensitivity and resolution in 3D and stacked components. This tender includes the delivery of a combined LIT and OBIRCH measurement system, including optional features, software support, documentation, delivery, acceptance testing, and warranty.
LOT-0002
Item 2: SEM Scanning Electron Microscope (IMWS-3.1).
The Fraunhofer Institute for Microstructure of Materials and Systems IMWS researches the application behavior, reliability, safety, and longevity of innovative materials in components and systems. The "Electronic Materials and Components" department of the Fraunhofer IMWS supports industry and research partners with its internationally recognized expertise in the fault analysis of electronic components. The Fraunhofer IMWS will expand its capabilities in advanced fault analysis and material characterization to support the development of new heterogeneous integration technologies, thereby addressing manufacturing and reliability challenges.
The electron beam probe system is needed for electrical fault isolation of modern integrated circuits (below 20 nm nodes), similar to laser-based testing methods with high-frequency active voltage contrast detection with nm resolution. The main application is the inspection of electrical signals at the transistor level and the reading of logical states in IC structures and volatile memory arrays to identify functional errors and conduct reliability tests of secured IC functions.
A complete functional electron beam probe system should be offered, including assembly, commissioning, and all necessary connections, parts, and approvals/certifications for operation. The components and specific requirements are listed below.