Electronic integrated circuits and microassemblies | Tenderlake

Electronic integrated circuits and microassemblies

Contract Value:
EUR 340K - 340K
Notice Type:
Contract Notice
Published Date:
22 December 2023
Closing Date:
30 January 2024
Location(s):
ITH36 Padova (IT Italy/ITALIA)
Description:
European open telematic tender for the supply of photodiode amplifiers for the enhancement of SXR Tomography diagnostics of RFX-mod2

Assignment of the supply of current-voltage amplifiers to be used to measure the currents produced by photodiodes exposed to the X-ray flux emitted by the plasma of RFX-Mod2, for the Fusion Research Center of the University of Padua.

The contract consists in the supply of current-voltage amplifiers to be used to measure the currents produced by photodiodes exposed to the X-ray flux emitted by the plasma of RFX-Mod2, as described in detail in the Technical Specifications. The scope of delivery also includes:

- manuals, technical documentation, control software,

- spare parts included in the amount offered for 5 (five) years,

- transport and delivery service,

- testing at the supplier and at the headquarters of the Fusion Research Centre (RFX Consortium),

- Minimum warranty of 24 (twenty-four) months, including technical assistance service.

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The Buyer:
Università degli Studi di Padova
CPV Code(s):
31712110 - Electronic integrated circuits and microassemblies