Research, testing and scientific technical simulator
Contract Value:
EUR 2M - 2M
Notice Type:
Contract Notice
Published Date:
13 July 2021
Closing Date:
26 August 2021
Location(s):
ITH20 Trento (IT Italy/ITALIA)
Description:
Providing a Bonding and Debonding Line
The contract is aimed at providing a bonding and debonding line for the development of the FBK Facility “3D Integration” in the context of the IPCEI microelectronics project.
Prototyping line for bonding and debonding of silicon wafers.