The subject matter of this contract is the supply and installation of scientific equipment to INL, listed below and detailed in Schedule V attached of the standard specifications. The equipment listed in Schedule V are the lots that the tender comprises.
Tenderers may bid for one or more lots. The subject matter of the contract, in all cases, does not include so-called refurbished scientific instruments and equipment.
The five lots comprising the tender are as follows;
1) Scrubber system top abate cleanroom process gases;
2) Wafer optical inspection systems for quality control;
3) Pick and place bonding system;
4) Plasma Asher;
5) Wafer spin rise clean and dry system.
This lot concerns the acquisition of one Scrubber system (or multiple units) required for hazardous process gas exhaust abatement from standard INL cleanroom process tools (mostly thermal/CVD and dry etching tools).
This lot concerns the acquisition of one Scrubber system (or multiple units) required for hazardous process gas exhaust abatement from standard INL cleanroom process tools (mostly thermal/CVD and dry etching tools).
Tender for a sub-micron die-bonder for precision die attach and advanced chip packaging. The equipment should be able to handle a wide range of applications, including opto-devices assembly (LEDs, photodetectors, Lens, micro-optics), generic MEMS and MOEMS assembly, 2.5D and 3D IC assembly (stacking), Flip-chip assembly and precision die bonding (glueing an curing). The system should run most of the basic bonding technologies such as thermosonic, ultrasonic, thermocompression, soldering/eutectic, adhesive and sintering and able to handle component sizes from 30 μm x 30 μm up to 20 mm x 20 mm.
The system has its main purpose for prototyping but it also expected support for low volume production and therefore the ability to handle components from full diced wafers (200 mm) or sections of wafers.
Compact bench top Microwave Plasma System for Photoresist stripping, polymers and Surface cleaning and removal of organic passivating layers and masks polymers activation and modification, capable of batch processing of up to 25 wafers with 200 mm.
Compact bench top Spin Rinse Dryer System for substrate cleaning,rinsing with DI water and N2 drying wafers capable of batch processing of up to 25 wafers with 200 mm.