The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinafter referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.

It concerns the supply and submission of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation tool (dicing) (hereinafter referred to as "the tool"). The tool is designed to be able to singulate wafers by means of a laser technique and to trim the edges by making circular cuts. The wafers to be machined consist of copper, LowK or other metal or dielectric films

LOT-0001
1
202312051 - 1.
LASER BASED DICING TOOL